DB107 1A Bridge Rectifier 1000V for Arduino, ESP32 & Robotics Projects
Key Highlights
- ✓Glass passivated die construction Low forward voltage drop High current capability High surge current capability Molded plastic body with UL 94V-0 rating Pb-free (RoHS compatible) Halogen-free versions available (suffix “-HF”) Polarity marking on case Any mounting position accepted Solderable plated leads (per MIL-STD‐202, Method 208)
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Below are the key parameters (typical/maximum) for the DB107 (bridge) device
Symbol Parameter Value / Range Units / Notes VRRM Peak repetitive reverse (blocking) voltage 1000 V Farnell +2 ALLDATASHEET +2 VRMS RMS reverse voltage 700 V Farnell +1 IF(AV) Average forward rectified current (at typical conditions) 1.0 A TME +2 Farnell +2 IFSM Non-repetitive peak forward surge current (8.3 ms half sine) ~ 30 A Diodes Incorporated +3 Farnell +3 Good-Ark Semiconductor +3 VF (max) Forward voltage drop per diode at rated current ~ 1.1 V (at 1 A) Diodes Incorporated +3 Farnell +3 Good-Ark Semiconductor +3 IR (max) Reverse (leakage) current ~ 10 µA at 25 °C ALLDATASHEET +3 doc.hotking.com +3 Farnell +3 IR (at 125 °C) Reverse leakage at high temp ~ 500 µA doc.hotking.com +2 Good-Ark Semiconductor +2 I²t (fuse rating, t < 8.3 ms) Energy for fusing ~ 10.4 A²·s Farnell +2 Good-Ark Semiconductor +2 Thermal Resistance (θJA) Junction-to-ambient (on PCB) ~ 40 °C/W Farnell +2 Good-Ark Semiconductor +2 Operating Junction Temp (TJ) Operating temp range -55 °C to +150 °C Good-Ark Semiconductor +2 TME +2 Storage Temp (TSTG) Storage temp range -55 °C to +150 °C Good-Ark Semiconductor +2 TME +2 Lead Temperature (soldering, 10 s) Max lead temp during soldering ~ 260 °C ALLDATASHEET +2 Good-Ark Semiconductor +2